Provide semi-automatic and fully automatic loading and unloading solutions for silicon wafer testing platforms.

Main configuration：

Semi automatic/fully automatic high-precision probe station

Piezoelectric motion system

Hexapod Movement System

Probe card device

Instrument control cabinet

Camera positioning system

laser range finder

IPC

Control and testing software

Parameters：

1. Suitable for 8-inch wafers, compatible with 6-inch wafers, other sizes require additional customization;

2. Test content: optical and electrical measurements of coupling efficiency, insertion transmission loss, polarization loss, wavelength, 3dB bandwidth, PD performance, etc;

3. Use high-resolution cameras to achieve Die positioning and FA positioning

4. MAP maps and files can be generated according to customer requirements; Multi Bin classification display Mapping function;

5.RT～+ 200℃ ；

6. The coupling repetition accuracy is less than 0.2dB; the coupling time per die is less than 2.5S (search distance is less than 400 microns);

7. Air floating vibration isolation platform (configured with shock absorption scheme according to customer needs);